Adesiv ADECON E3 PLUS - 25Kgs

ADECON E3 PLUS

Water-Based Monocomponent Adhesive for Wood Floors

Product Description:
ADECON E3 PLUS is a single-component vinyl adhesive in water dispersion, specially formulated for bonding unvarnished solid wood floors of any size onto concrete subfloors or other types of absorbent substrates. It delivers excellent performance, easy application, and is solvent-free, making it ideal for indoor use, including installations over underfloor heating systems.

Thanks to its high initial tack and flexible bond, ADECON E3 PLUS is a reliable and professional-grade solution for timber flooring.

Main Features

• Water-based, solvent-free formulation
  
  

• Monocomponent, ready-to-use—no mixing required
  
  

• High-performance adhesive for unvarnished wood floors
  
  

• Very easy to apply with a notched trowel
  
  

• Suitable for absorbent subfloors with radiant heating
  
  

• Quick setting—walkable after 48–72 hours, sandable after 10 days
  
  

• Environmentally safer and low-odour
  
  

Recommended Uses

• Bonding of unvarnished solid wood flooring, including:
  
  

• Laminated parquet
  
  

• Industrial parquet
  
  

• Lamparquet
  
  

• Narrow wood strips
  
  

• Suitable substrates:
  
  

• Cement-based screeds
  
  

• Cement-lime mortars
  
  

• Absorbent concrete floors
  
  

• Chipboard and Masonite panels
  
  

• Absorbent screeds with underfloor heating (fully cured)
  
  

Not Suitable For

• Non-absorbent subfloors
  
  

• Anhydrite screeds (calcium sulphate)
  
  

• Screeds without an appropriate vapour barrier
  
  

• Subfloors with moisture content above 2% (or 1.7% for heated screeds)
  
  

• Pre-finished parquet
  
  

• Damp or humid environments
  
  

• Areas subject to freezing conditions
  
  

Technical Specifications

Surface Preparation

• Subfloor must be compact, dry, clean, and free from dust, paint, wax, or loose materials.
  
  

• Verify subfloor moisture using a carbide hygrometer:
  
  

• <2% for traditional screeds
  
  

• <1.7% for screeds with underfloor heating
  
  

• Wood moisture content must be between 7% and 11%.
  
  

• A vapour barrier is required if there is a risk of rising damp.
  
  

• For low-porosity or dusty screeds, mechanical sanding and vacuuming are recommended.
  
  

• Weak or dusty surfaces should be treated with K31 primer.
  
  

Application Guidelines

• Allow both adhesive and wood to reach ambient temperature before use.
  
  

• Apply using a notched trowel suited to the size of the wood strips.
  
  

• Press flooring firmly into the adhesive bed to ensure full contact.
  
  

• Maintain an expansion gap of 8–10 mm between flooring and walls.
  
  

• For tongue-and-groove boards, place weights on top to maintain firm contact during curing.
  
  

Do not glue side joints unless specified by the wood manufacturer.